Members of Program Committee 2022


  • J. Alt, Infineon Technologies AG
  • W. Anheier, University of Bremen
  • B. Becker, University of Freiburg
  • R. Drechsler, University of Bremen and DFKI GmbH
  • S. EggersglĂŒĂŸ, Siemens Digital Industries Software
  • P. Engelke, Infineon Technologies AG
  • G. Fey, Hamburg University of Technology
  • A.-P. Fonseca-MĂŒller, Bosch Sensortec GmbH
  • M. Gössel, University of Potsdam
  • S. Hellebrand, Paderborn University
  • K. Hofmann, Technical University of Darmstadt
  • S. Holst, Kyushu Institute of Technology
  • W. Hoppe, Rheinmetall AG
  • F. Hopsch, Fraunhofer IIS EAS Dresden
  • S. Huhn, University of Bremen and DFKI GmbH
  • R. Krenz-Baath, Hamm-Lippstadt UAS
  • M. Krstic, University of Potsdam and IHP GmbH
  • V. Petrovic, Robert Bosch GmbH
  • I. Polian, University of Stuttgart
  • F. Pöhl, Apple Inc.
  • S. Sattler, University Erlangen-NĂŒrnberg
  • M. Sauer, Advantest Europe GmbH
  • M. Schillinsky, NXP Semiconductors Germany GmbH
  • J. Schlöffel, Siemens Digital Industries Software
  • H. Schmidt, IBM Deutschland GmbH
  • M. Schölzel, Nordhausen University of Applied Sciences
  • J. Sepulveda, Airbus Defence and Space
  • M. Tahoori, Karlsruhe Institut of Technology (KIT)
  • D. Tille, Infineon Technologies AG
  • M. Wahl, University of Siegen
  • H.-J. Wunderlich, University of Stuttgart
General Chair

Dr.-Ing. Sebastian Huhn
Senior Researcher
University of Bremen
Bibliothekstrasse 5
28359 Bremen

E-Mail: huhn@uni-bremen.de

Program Chair

Prof. Dr.-Ing. Görschwin Fey
Professor for Computer Engineering
Hamburg University of Technology
Am Schwarzenberg-Campus 3 (E)
21073 Hamburg

E-Mail: goerschwin.fey@tuhh.de