ETS 2018

23rd IEEE European Test Symposium | May 28- June 01, 2018 | Bremen, Germany

Call for Vendor Sessions / TableTop Demos

The IEEE European Test Symposium (ETS) is Europe's premier forum dedicated to presenting and discussing scientific results, industrial application results, emerging ideas, applications, hot topics, and new trends in the area of electronic-based circuits and system testing and reliability. ETS is organized annually in a different European country. In 2018, ETS will be held in Bremen, Germany, and will take place during May 28- June 1. ETS is the nucleus of the European Test Week which includes TSS (Test Spring School), fringe workshops, and fringe meetings.

ETS offers commercial vendors the opportunity to give technical presentations in Vendor Sessions in a track parallel to the regular paper sessions. Typical content includes product descriptions, case studies, best practices, and user testimonials of products or solutions. ETS also offers the opportunity for Table-Top Demos during the event. Table-Top Demo participants get a table, poster board, and electricity outlet provided by ETS. A Table-Top Demo may include displaying slides and/or demoing tools or products.

These presentations will be listed in the symposium program along with the other sessions, and should be targeted to ETS' technical audience. Vendor Sessions and Table-Top Demos differ from other ETS presentations in that company names, logos, and product names may be mentioned explicitly. Proposal selection is based on technical content and relevance to ETS audience and topics. Available slots will be assigned in a first-come-first-served order, but priority will be given to Corporate Supporters with higher priority for higher support grades. The areas of interest include (but are not limited to) the following topics:

  • Analog Test
  • ATE Hardware and Software
  • Automatic Test Generation
  • Board Test and Diagnosis
  • Boundary Scan Test
  • Built-In Self-Test (BIST)
  • Current-Based Test
  • Defect-Based Test
  • Delay and Performance Test
  • Dependability and Functional Safety
  • Design for Test (DfT)
  • Design for Manufacturing (DfM)
  • Diagnosis and Silicon Debug
  • Economics of Test
  • Test of Emerging Technologies
  • Failure Analysis
  • Fault Injection
  • Fault Modeling and Simulation
  • Fault Tolerance
  • GPU Test
  • Hardware Trojans
  • Hardware and IP Security Test and Verification
  • High-Speed I/O Test
  • Low-Power IC Test
  • Memory Test and Repair
  • MEMS Test
  • Microprocessor Test
  • Mixed-Signal Test
  • Multi-/Many-core Processor Test
  • Nanotechnology Test
  • On-line Test
  • Power Issues in Test
  • Reconfigurable System Test
  • Reliability
  • Reliability-Security Trade-offs
  • RF Test
  • Security and Trust Issues in Test
  • Self-Repair
  • Sensor Test
  • Side-channels Analysis
  • Signal Integrity Test
  • SiP, Stacked, 3D IC Test
  • SoC Test
  • Soft Errors
  • Standards in Test
  • Statistical Learning in Test
  • Test Compression
  • Test Quality
  • Test Synthesis
  • Thermal Issues in Test
  • Validation and Verification
  • Variability Issues in Test
  • Yield Analysis and Enhancement


Guidelines for Proposal Authors

Proposals for the Vendor Sessions should be technical or application focused, rather than overly sales-and-marketing focused. A submission to the ETS'18 Vendor Sessions can be an abstract, extended abstract or full paper (max. six pages); submission of a full paper is preferred, but not required. Proposal selection is based on the technical content and relevance to ETS'18 audience and topics. Priority will be given to Corporate Supporters with higher priority for higher support grades. By means of submission, vendor session presenters agree to register for and participate in ETS'18, in case the submission is accepted.

Submission Website
Submissions should be made electronically as a single PDF file here.

Publications
All material that vendor session authors are willing to provide, such as abstracts, papers, slides, posters, etc, will be included in the ETS'18 Informal Digest of Papers, which will be made available to all participants.

Key Dates
Submission deadline (for VS/TTD's only): January 30, 2018
Notification of acceptance: February 12, 2018
Camera-ready manuscript: March 13, 2018

ETS'18 Corporate Support

Every year, ETS is financially supported by several companies. The support money is used to cover costs associated with ETS and make the event accessible to even more attendees. In return, the corporate supporters are allowed to make publicity in various ways. ETS has defined four different support grades (Bronze, Silver, Gold, and Platinum), each with different support amounts and publicity options. To find out more, contact Juergen Schloeffel or Hans Manhaeve, details below.

More Information

Juergen Schloeffel - ETS'18 Industrial-Relations Chair
Phone: +49 40 48401 2808 / +49 172 8623680
E-mail: juergen_schloeffel@mentor.com

Hans Manhaeve - ETS'18 Industrial-Relations Chair
Phone: +32 50 319273 / +32 478 331003
E-mail: hans.manhaeve@ridgetop.eu

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